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 User's Guide
LCM
NHD320240WGC OTFHVZ#010-80:
NHD-320240WG-COTFH-VZ#-010-80
(Liquid Crystal Display Graphic Module)
RoHS Compliant
Newhaven Display 320 x 240 Dots W= Version Line G= Display Type- Graphic Model Serial Number White LED B/L FSTN (+) Transflective, 6:00 View, Wide Temperature (-20 ~ +70c) With built in Negative Voltage, Rohs
Backlight A(+5V)=PIN19, K=PIN20,
Intel 8080 interface mode
For product support, contact
Newhaven Display International 2511 Technology Drive, #101 Elgin, IL 60124
Tel: (847) 844-8795 Fax: (847) 844-8796
April 17, 2008
RECORDS OF REVISION
VERSION DATE REVISED PAGE NO.
DOC. FIRST ISSUE
SUMMARY
0
2006.06.23
First issue
Contents
1.Module classification information 2.Precautions in Use of LCM 3.General Specification 4.Absolute Maximum Ratings 5.Electrical Characteristics 6.Optical Characteristics 7.Interface Description 8.Contour Drawing & Block Diagram 9. Display Control Instruction 10.Reliability 11. Backlight Information 12.Inspection specification 13.Material List of Components for RoHs
3 20
3
1.Module Classification Information
NHD 320240 W G C0 T F H - VZ#-010-80
9
BrandNewhaven Display Display Font320 * 240 Dots Factory Line: W Display TypeHCharacter Type, GGraphic Type, C Color, XTab Type Model / Serial number: C0 Backlight Type With RA8835 Controller
TWhite LED ALED, Amber RLED, Red OLED, Orange GLED, Green TFSTN Negative YSTN Positive, Yellow Green MSTN Negative, Blue FFSTN Positive HTransflective, W.T,6:00 KTransflective, W.T,12:00 CTransmissive, N.T,6:00 FTransmissive, N.T,12:00 ITransmissive, W. T, 6:00 LTransmissive, W.T,12:00 NWithout backlight BEL, Blue green DEL, Green WEL, White FCCFL, White YLED, Yellow Green
LCD Mode
BTN Positive, Gray NTN Negative, GSTN Positive, Gray
LCD Polarize Type/ AReflective, N.T, 6:00 Temperature range/ DReflective, N.T, 12:00 View direction GReflective, W. T, 6:00
JReflective, W. T, 12:00 BTransflective, N.T,6:00 ETransflective, N.T.12:00 9 Special Code
#: RoHS ; V: Built in Negative voltage Z: NT7086 Driver Control RA8835 -010: Backlight A(+5V)=PIN19, K=PIN20 -80: Intel 8080 Interface mode
Newhaven Display International, LLC
NHD-320240WG-C0TFH-VZ#-010-80
2.Precautions in Use of LCD Module
(1)Avoid applying excessive shocks to the module or making any alterations or modifications to it. (2)Don't make extra holes on the printed circuit board, modify its shape or change the components of LCD Module. (3)Don't disassemble the LCM. (4)Don't operate it above the absolute maximum rating. (5)Don't drop, bend or twist LCM. (6)Soldering: only to the I/O terminals. (7)Storage: please storage in anti-static electricity container and clean environment.
3.General Specification
ITEM Number of dots Outline dimension View area Active area Dot size Dot pitch LCD type View direction Backlight STANDARD VALUE 320x240 148.02 (W)x 120.24(H)x 15.6max(T) 120.14(W)x 92.14(H) 115.18(W)x 86.38(H) 0.34(W)x 0.34(H) 0.36(W)x 0.36(H) FSTN Positive , Transflective 6 o'clock LED , White UNIT dots mm mm mm mm mm
5 20
4.Absolute Maximum Ratings
ITEM Operating Temperature Storage Temperature Input Voltage Supply Voltage For Logic Supply Voltage For LCD SYMBOL TOP TST VI VDD VDD-VEE MIN. -20 -30 0 0 0 TYP. MAX. +70 +80 Vdd 6.5 32 UNIT V V V
5.Electrical Characteristics
ITEM Logic Voltage Supply Voltage For LCD Input High Volt. Input Low Volt. Output High Volt. Output Low Volt. Supply Current VDD-VO SYMBOL VDD-VSS CONDITION Ta=-20 Ta=25 Ta=70 VIH VIL VOH VOL IDD MIN. 4.5 23.0 0.5VDD 0 2.4 95.0 TYP. 5.0 23.8 100.0 MAX. 5.5 25.0 VDD 0.2VDD 0.4 110.0 UNIT V V V V V V V V mA
6 20
6.Optical Characteristics
ITEM View Angle (H) Contrast Ratio Response Time T fall CR T rise CR2 -45 SYMBAL CONDITION MIN (V) CR2 30 TYP 5 200 150 MAX 60 45 300 200 UNIT deg. deg. ms ms
6.1
Definitions
View Angles
Z ( Visual angle direction )
Contrast Ratio
Brightness at selected state ( BS ) Brightness at non-selected state ( Bns ) Selected state CR =
Brightness (%)
Non-selected state
X
Bs Bns
Response time
Nonselected Condition
Brightness
100 %
Y
Operating voltage for LCD driving
Selected Condition
Nonselected Condition
90 % 10 %
tr Rise Time
7 20
td Decay Time ( fall time tf )
7.Interface Description
JM (left) short , for 8080 MPU family
Pin No. 1 2 3 4 5 6 7~14 15 16 17 18 19 20
Symbol VSS VDD VO /RD /WR A0 DB0~DB7 CS RES VEE FGND A K
Level 0V 5.0V Ground Power supply for Logic
Description
(Variable) Driving voltage for LCD H/L H/L H/L H/L H/L H/L -25V Active Low=Read data /WR signal input to select the write mode Active Low = Write data R/W=L, A0=H: Command Write R/W=H, A0=H: Status Read Data bus Chip select ,Active L Controller reset signal, Active L Negative voltage output (Optional) Frame Ground 5.0V 0V Backlight supply Backlight ground A0=L: Data Write A0=L: Data Read
8 20
8.Contour Drawing & Block diagram
4.02 4.44 13.74 16.62 13.97 16.45
139.98 136.2 120.14(V A ) 115.18(A A ) 15.6M A X 10.5
X H -3P EQ 120.24 0.5 92.14(VA) 86.38(AA) 105.4 112.2 320*240 D ots
190.05.0
20 19
2 1
2.54
5.0
4- 3.5PTH 4- 6.0PA D 148.02
22.86
(P2.54*9)
21.06
20- 1.0PTH 20- 1.8PA D L ED B /L
1.6
0.5
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
V ss V dd Vo RD WR A0 DB0 DB1 DB2 DB3 DB4 DB5 DB6 DB7 CS R ES V ee FG N D A K
4.02
7.11
T he non-specified tolerance of dim ension is 0.3 m m .
0.36 0.34
0.36
0.34 D O T SIZE SC A L E 10/1
RD WR A0 DB0~DB7 CS RES
CL1 M FLM
Driver
Com1~80
RA8835 Controller
32K SRAM Power ON Reset * Bias and Power Circuit Vdd Vo
Com81~160
Driver
MPU
320X240 DOT
Com161~240 Seg1~80 Seg81~160 Seg161~240 Seg241~320
Driver
VR 20K
Driver
Driver
Driver
Driver
Vee Internal contrast adjustment.
N.V. Generator
CL2 DB0~DB3
Frame PAD FGND
*:6800 family or 8080family interface selectable.
9 20
9.Display Control Instruction PLEASE TO CONSUL RA8835 SPEC
10 20
10.RELIABILITY
Content of Reliability Test (wide temperature, -20~70) Environmental Test
Test Item
High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation time. Endurance test applying the high storage temperature for a long time. Endurance test applying the electric stress (Voltage & Current) and the thermal stress to the element for a long time.
Content of Test
Endurance test applying the high storage temperature for a long
Test Condition
80 200hrs -30 200hrs 70 200hrs
Note
2
1,2
----
Endurance test applying the electric stress under low temperature -20 for a long time. The module should be allowed to stand at 60,90%RH max For 96hrs under no-load condition excluding the polarizer, Then taking it out and drying it at normal temperature. The sample should be allowed stand the following 10 cycles of operation -20 25 70 -20/70 10 cycles 30min 5min 1 cycle Total fixed amplitude : 15mm Endurance test applying the vibration during transportation and using. Vibration Frequency : 10~55Hz One cycle 60 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS=1.5k 30min 200hrs 60,90%RH 96hrs
1
1,2
Thermal shock resistance
----
Vibration test
3
Static electricity test
Endurance test applying the electric stress to the terminal.
CS=100pF 1 time
----
Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal Temperature and humidity after remove from the test chamber. Note3: Vibration test will be conducted to the product itself without putting it in a container.
11 20
11. Backlight Information
Specification
PARAMETER Supply Current Supply Voltage Reverse Voltage Luminous Intensity Wave Length Life Time Color SYMBOL MIN ILED 130 TYP 160 5.0 280 50K MAX 200 5.1 8 UNIT mA V V TEST CONDITION VatPIN19=5.0V
V(PIN19) 4.8 VR IV p White 260
CD/M2 ILED=160mA nm Hr. ILED=160mA ILED=160mA
Note: The LED of B/L is drive by current only, drive voltage is for reference only. drive voltage can make driving current under safety area (current between minimum and maximum).
LED B\L Drive Method 1.Drive from 19,20 R 19 B/L 20
12 20
12. Inspection specification
NO Item Criterion 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character , dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. AQL
01
Electrical Testing
0.65
02
Black or white 2.1 White and black spots on display 0.25mm, no more than three spots on LCD 2.5 white or black spots present. (display only) 2.2 Densely spaced: No more than two spots or lines within 3mm 3.1 Round type : As following drawing =( x + y ) / 2 SIZE 0.10 0.100.20 black 0.200.25 white 0.25
03
LCD spots, spots, contamination 3.2 Line type : (As following drawing) (non-display) Length Width --W0.02 L3.0 0.02W0.03 L2.5 0.03W0.05 --0.05W If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. Size
Acceptable Q TY Accept no dense 2 1 0
2.5
Acceptable Q TY Accept no dense 2.5 2 As round type Acceptable Q TY Accept no dense 3 2 0 3 2.5
0.20 0.200.50 0.501.00 1.00 Total Q TY
04
Polarizer bubbles
13 20
NO 05
Item Scratches
Criterion Follow NO.3 LCD black spots, white spots, contamination Symbols Define: x: Chip length k: Seal width y: Chip width t: Glass thickness z: Chip thickness a: LCD side length
AQL
L: Electrode pad length:
6.1 General glass chip : 6.1.1 Chip on panel surface and crack between panels:
z: Chip thickness Chipped 06 glass Z1/2t 1/2tz2t
y: Chip width Not over viewing area Not exceed 1/3k
x: Chip length x1/8a x1/8a 2.5
If there are 2 or more chips, x is total length of each chip.
6.1.2 Corner crack:
z: Chip thickness Z1/2t 1/2tz2t
y: Chip width Not over viewing area Not exceed 1/3k
x: Chip length x1/8a x1/8a
If there are 2 or more chips, x is the total length of each chip.
14 20
NO
Item
Criterion Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : 6.2.1 Chip on electrode pad :
AQL
y: Chip width x: Chip length y0.5mm x1/8a 6.2.2 Non-conductive portion:
z: Chip thickness 0 zt
06
Glass crack
2.5
y: Chip width x: Chip length z: Chip thickness y L x1/8a 0 zt If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged. 6.2.3 Substrate protuberance and internal crack. y: width y1/3L x: length xa
15 20
NO 07
Item Cracked glass
Criterion The LCD with extensive crack is not acceptable. 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesnt light or color wrong.
AQL 2.5 0.65 2.5 0.65
08
Backlight elements
09
Bezel
9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications. 10.1 COB seal may not have pinholes larger than 0.2mm or contamination. 10.2 COB seal surface may not have pinholes through to the IC. 10.3 The height of the COB should not exceed the height indicated in the assembly diagram. 10.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 10.5 No oxidation or contamination PCB terminals. 10.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 10.7 The jumper on the PCB should conform to the product characteristic chart. 10.8 If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down. 10.9 The Scraping testing standard for Copper Coating of PCB
X
2.5 0.65
2.5 2.5 0.65 2.5
10
PCBCOB
2.5 0.65
0.65 2.5 2.5
11
Soldering
X * Y<=2mm2 11.1 No un-melted solder paste may be present on the PCB. 11.2 No cold solder joints, missing solder connections, oxidation or icicle. 11.3 No residue or solder balls on PCB. 11.4 No short circuits in components on PCB.
Y
2.5 2.5 2.5 0.65
16 20
NO
Item
Criterion
AQL
12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP. 12.2 No cracks on interface pin (OLB) of TCP. 12.3 No contamination, solder residue or solder balls on product. 12.4 The IC on the TCP may not be damaged, circuits. 12.5 The uppermost edge of the protective strip on the interface pin must be present or look as if it cause the interface pin to sever. General 12 appearance 12.6 The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color. 12.7 Sealant on top of the ITO circuit has not hardened. 12.8 Pin type must match type in specification sheet. 12.9 LCD pin loose or missing pins. 12.10 Product packaging must the same as specified on packaging specification sheet. 12.11 Product dimension and structure must conform to product specification sheet.
2.5
0.65 2.5 2.5 2.5
2.5
2.5 0.65 0.65 0.65
0.65
17 20
13 Material List of Components for RoHs
1. Newhaven Display hereby declares that all of or part of products (with the mark "#"in code), including, but not limited to, the LCM, accessories or packages, manufactured and/or delivered to your company (including your subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable EU directives and regulations, including the following substances. Exhibit AThe Harmful Material List
Material Limited Value
(Cd) 100 ppm
(Pb) 1000 ppm
(Hg) 1000 ppm
(Cr6+) 1000 ppm
PBBs 1000 ppm
PBDEs 1000 ppm
Above limited value is set up according to RoHS.
2.Process for RoHS requirement (1) Use the Sn/Ag/Cu soldering surfacethe surface of Pb-free solder is rougher than we used before. (2) Heat-resistance temp. Reflow250,30 seconds Max. Connector soldering wave or hand soldering320, 10 seconds max. (3) Temp. curve of reflow, max. Temp.2355 Recommended customer's soldering temp. of connector280, 3 seconds.
18 20
Newhaven LCM Sample Estimate Feedback Sheet Module Number 1Panel Specification 1. Panel Type 2. 3. 4. 5. 6. 7. 8. 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 1. 2. 3. 4. 5. 1. 2. 3. 4. 5. 6. 7. View Direction Numbers of Dots View Area Active Area Operating Temperature Storage Temperature Others PCB Size Frame Size Material of Frame Connector Position Fix Hole Position Backlight Position Thickness of PCB Height of Module Others Pitch of Connector Hole size of Connector Mounting Hole size Mounting Hole Type Others B/L Type B/L Color B/L Driving Current Brightness of B/L B/L Solder Method Others Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass Pass NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , NG , Page: 1 Pass Pass Pass Pass Pass Pass Pass NG , NG , NG , NG , NG , NG , NG ,
2Mechanical Specification
Height of Frame to PCB Pass
3Relative Hole Size
4Backlight Specification
B/L Driving Voltage (Reference for LED Type) Pass
Go to page 2
19 20 Newhaven
Newhaven Module Number 5Electronic Characteristics of Module 1. Input Voltage Pass 2. 3. 4. 5. 6. 7. 8. 9. 10. Supply Current Driving Voltage for LCD Contrast for LCD B/L Driving Method Negative Voltage Output Interface Function LCD Uniformity ESD test Others Pass Pass Pass Pass Pass Pass Pass Pass Pass Page: 2 NG , NG , NG , NG , NG , NG , NG , NG , NG , NG ,
6Summary
Sales signature Customer Signature Date / /
20 20


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